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PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Soldering Station Temperature: 100℃ -

SKU: 62098527524
4.5
USD45.55 USD79.55

Pay in 4 interest-free payments of $11.39 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 6 - Sep 11

Description

Soldering Station Temperature: 100℃ - 480℃

P8 LITE SMART

the Infrared Thermal Image Analyzer can test your cell phone main board

Specified Microscope Extension Holder and Metal Base Phone PCB Desoldering / Soldering Repair

china phone SK Hynix

PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Soldering Station Temperature: 100℃ -PHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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